Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC) Details the pros and cons of each technology with varying applications Examines packaging ramifications of high density interconnects (HDI)
EAN/ISBN : 9780071500654
Publisher(s): McGraw-Hill, McGraw-Hill Professional
Format: ePub/PDF

Author(s): Gilleo, Ken