PHILIPS BP2.2U AA CHASSIS PLASMA TV Service Manual

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Technical Specifications, Connections, and Chassis Overview
Cinch: Video CVBS - In, Audio - In Ye - Video CVBS 1 VPP / 75 ohm Wh - Audio L 0.5 VRMS / 10 kohm Rd - Audio R 0.5 VRMS / 10 kohm SVHS (Hosiden): Video Y/C - In 1 - Ground Y Gnd 2 - Ground C Gnd 3 - Video Y 1 VPP / 75 ohm 4 - Video C 0.3 VPPP / 75 ohm 1.2.2 Digital Media Reader with USB2.0 (only for BP2.2) In some versions, a 6-in-1 card reader unit is available, which is connected via USB to the Small Signal Board (see also par. "Technical Specifications" -> "Multimedia"). This unit also contains two USB2.0 connectors (see figure rear connections). 1.2.3 Rear Connections (under side)
LAN POD SLOT IEEE1394 UART HDMI 1
19 18 1 2

BP2.2U, BP2.3U
Gnd

1.

EN 3
H

20 - Ground jq jq jq 1.2.4 Aerial - In - - F-type (US)

Coax, 75 ohm

D

H H j j

Rear Connections (rest)

HDMI 2
19 18 1 2

ANTENNA

OPTIONAL

F_15400_003.eps 070305

MONITOR OUT

Figure 1-3 Rear connections (under side) POD: CableCARD Interface 68p - See diagram B10A IEEE1394 (optional) 1 - Data (-) 2 - Data (+) 3 - Data (-) 4 - Data (+) RJ45: LAN (optional) 8p - See diagram B9A Service Connector (UART) 1 - UART_TX Transmit 2 - Ground Gnd 3 - UART_RX Receive HDMI 1 & 2: Digital Video, Digital Audio - In
19 18 1 2
E_06532_017.eps 250505

S/PDIF OUT

L

R

CVBS

GEM STAR

jk

F_15400_001.eps 250505

TPBTPB+ TPATPA+

jk jk jk jk

Figure 1-5 Rear connections (rest) AV1 Cinch: Video YPbPrHV- In Gn - Video Y 1 VPP / 75 ohm Bu - Video Pb 0.7 VPP / 75 ohm Rd - Video Pr 0.7 VPP / 75 ohm Bk - H-sync 0-5V Bk - V-sync 0-5V AV1 Cinch: Video CVBS - In, Audio - In Ye - Video CVBS 1 VPP / 75 ohm Wh - Audio L 0.5 VRMS / 10 kohm Rd - Audio R 0.5 VRMS / 10 kohm DIGITAL AUDIO Cinch: S/PDIF - In Bk - Coaxial 0.2 - 0.6VPP / 75 ohm AV1 S-Video (Hosiden): Video Y/C - In 1 - Ground Y Gnd 2 - Ground C Gnd 3 - Video Y 1 VPP / 75 ohm 4 - Video C 0.3 VPPP / 75 ohm AV2 S-Video (Hosiden): Video Y/C - In 1 - Ground Y Gnd 2 - Ground C Gnd 3 - Video Y 1 VPP / 75 ohm 4 - Video C 0.3 VPPP / 75 ohm AV2 Cinch: Video CVBS - In, Audio - In Ye - Video CVBS 1 VPP / 75 ohm Wh - Audio L 0.5 VRMS / 10 kohm Rd - Audio R 0.5 VRMS / 10 kohm AV3 Cinch: Video YPbPr - In Rd - Video Pr 0.7 VPP / 75 ohm Bu - Video Pb 0.7 VPP / 75 ohm Gn - Video Y 1 VPP / 75 ohm

jk

jq jq jq jq jq

k H j

jq jq jq

jq

Figure 1-4 HDMI (type A) connector 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 - D2+ - Shield - D2- D1+ - Shield - D1- D0+ - Shield - D0- CLK+ - Shield - CLK- n.c. - n.c. - DDC_SCL - DDC_SDA - Ground - +5V - HPD Data channel Gnd Data channel Data channel Gnd Data channel Data channel Gnd Data channel Data channel Gnd Data channel j H j j H j j H j j H j j jk H j j

H H j j

H H j j

jq jq jq

DDC clock DDC data Gnd Hot Plug Detect

jq jq jq

EN 4

1.

BP2.2U, BP2.3U

Technical Specifications, Connections, and Chassis Overview
kq GEMSTAR Mini Jack: Remote Control - In/Out 1 - Ground Gnd 2 - RXD 3 - TXD 4 - IR-OUT 5 - RXD H j k k k

DIGITAL AUDIO Cinch: S/PDIF - Out Bk - Coaxial 0.4 - 0.6VPP / 75 ohm

MONITOR OUT Cinch: Video CVBS - Out, Audio - Out Ye - Video CVBS 1 VPP / 75 ohm kq Wh - Audio L 0.5 VRMS /10 kohm kq Rd - Audio R 0.5 VRMS / 10 kohm kq

1.3

Chassis Overview

AL

AMBI LIGHT PANEL (OPTIONAL)

AMBI LIGHT PANEL (OPTIONAL)

AL

AUDIO AMPLIFIER

C

B

SMALL SIGNAL PANEL

EXTERNAL I/O PANEL

BE

LED PANEL

J

E

CONTROL BOARD SIDE I/O PANEL

MULTI MEDIA CARD READER & USB (OPTIONAL)

D

F_15400_110.eps 310505

Figure 1-6 PWB/CBA locations

Safety Instructions, Warnings, and Notes

BP2.2U, BP2.3U

2.

EN 5

2. Safety Instructions, Warnings, and Notes
Index of this chapter: 2.1 Safety Instructions 2.2 Warnings 2.3 Notes · Service Default Mode (see chapter 5) with a color bar signal and stereo sound (L: 3 kHz, R: 1 kHz unless stated otherwise) and picture carrier at 475.25 MHz for PAL, or 61.25 MHz for NTSC (channel 3). Where necessary, measure the waveforms and voltages with (D) and without (E) aerial signal. Measure the voltages in the power supply section both in normal operation (G) and in stand-by (F). These values are indicated by means of the appropriate symbols. The semiconductors indicated in the circuit diagram and in the parts lists, are interchangeable per position with the semiconductors in the unit, irrespective of the type indication on these semiconductors. Manufactured under license from Dolby Laboratories. "Dolby", "Pro Logic" and the "double-D symbol", are trademarks of Dolby Laboratories.

2.1

Safety Instructions
Safety regulations require that during a repair: · Connect the set to the Mains/AC Power via an isolation transformer (> 800 VA). · Replace safety components, indicated by the symbol h, only by components identical to the original ones. Any other component substitution (other than original type) may increase risk of fire or electrical shock hazard. Safety regulations require that after a repair, the set must be returned in its original condition. Pay in particular attention to the following points: · Route the wire trees correctly and fix them with the mounted cable clamps. · Check the insulation of the Mains/AC Power lead for external damage. · Check the strain relief of the Mains/AC Power cord for proper function. · Check the electrical DC resistance between the Mains/AC Power plug and the secondary side (only for sets which have a Mains/AC Power isolated power supply): 1. Unplug the Mains/AC Power cord and connect a wire between the two pins of the Mains/AC Power plug. 2. Set the Mains/AC Power switch to
the "on" position (keep the Mains/AC Power cord unplugged!). 3. Measure the resistance value between the pins of the Mains/AC Power plug and the metal shielding of the tuner or the aerial connection on the set. The reading should be between 4.5 Mohm and 12 Mohm. 4. Switch "off" the set, and remove the wire between the two pins of the Mains/AC Power plug. · Check the cabinet for defects, to avoid touching of any inner parts by the customer.

·

·

2.3.2

Schematic Notes · All resistor values are in ohms and the value multiplier is often used to indicate the decimal point location (e.g. 2K2 indicates 2.2 kohm). Resistor values with no multiplier may be indicated with either an "E" or an "R" (e.g. 220E or 220R indicates 220 ohm). All capacitor values are given in micro-farads (µ= x10-6), nano-farads (n= x10-9), or pico-farads (p= x10-12). Capacitor values may also use the value multiplier as the decimal point indication (e.g. 2p2 indicates 2.2 pF). An "asterisk" (*) indicates component usage varies. Refer to the diversity tables for the correct values. The correct component values are listed in the Spare Parts List. Therefore, always check this list when there is any doubt.

·

· · · ·

2.3.3

Rework on BGA (Ball Grid Array) ICs General Although (LF)BGA assembly yields are very high, there may still be a requirement for component rework. By rework, we mean the process of removing the component from the PWB and replacing it with a new component. If an (LF)BGA is removed from a PWB, the solder balls of the component are deformed drastically so the removed (LF)BGA has to be discarded. Device Removal As is the case with any component that, it is essential when removing an (LF)BGA, the board, tracks, solder lands, or surrounding components are not damaged. To remove an (LF)BGA, the board must be uniformly heated to a temperature close to the reflow soldering temperature. A uniform temperature reduces the chance of warping the PWB. To do this, we recommend that the board is heated until it is certain that all the joints are molten. Then carefully pull the component off the board with a vacuum nozzle. For the appropriate temperature profiles, see the IC data sheet. Area Preparation When the component has
been removed, the vacant IC area must be cleaned before replacing the (LF)BGA. Removing an IC often leaves varying amounts of solder on the mounting lands. This excessive solder can be removed with either a solder sucker or solder wick. The remaining flux can be removed with a brush and cleaning agent. After the board is properly cleaned and inspected, apply flux on the solder lands and on the connection balls of the (LF)BGA. Note: Do not apply solder paste, as this has shown to result in problems during re-soldering.

2.2

Warnings
· All ICs and many other semiconductors are susceptible to electrostatic discharges (ESD w). Careless handling during repair can reduce life drastically. Make sure that, during repair, you are connected with the same potential as the mass of the set by a wristband with resistance. Keep components and tools also at this same potential. Available ESD protection equipment: ­ Complete kit ESD3 (small tablemat, wristband, connection box, extension cable and earth cable) 4822 310 10671. ­ Wristband tester 4822 344 13999. Be careful during measurements in the high voltage section. Never replace modules or other components while the unit is switched "on". When you align the set, use plastic rather than metal tools. This will prevent any short circuits and the danger of a circuit becoming unstable.

· · ·

2.3
2.3.1

Notes
General · Measure the voltages and waveforms with regard to the chassis (= tuner) ground (H), or hot ground (I), depending on the tested area of circuitry. The voltages and waveforms shown in the diagrams are indicative. Measure them in the